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APTC90DAM60T1G Boost chopper Super Junction MOSFET VDSS = 900V RDSon = 60m max @ Tj = 25C ID = 59A @ Tc = 25C Application * AC and DC motor control * Switched Mode Power Supplies * Power Factor Correction Features * - Ultra low RDSon - Low Miller capacitance - Ultra low gate charge - Avalanche energy rated - Very rugged Kelvin source for easy drive Very low stray inductance Internal thermistor for temperature monitoring High level of integration Power Module 5 6 11 CR1 3 4 NTC Q2 9 10 1 2 12 * * * * Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * RoHS Compliant Pins 1/2 ; 3/4 ; 5/6 must be shorted together Absolute maximum ratings Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy Tc = 25C Tc = 80C Max ratings 900 59 44 150 20 60 462 8.8 2.9 1940 Unit V A V m W A mJ August, 2009 1-5 APTC90DAM60T1G - Rev 0 Tc = 25C These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTC90DAM60T1G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic IDSS RDS(on) VGS(th) IGSS Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current Test Conditions VGS = 0V,VDS = 900V VGS = 0V,VDS = 900V Min Tj = 25C Tj = 125C 2.5 Typ 1000 50 3 Max 200 60 3.5 200 Unit A m V nA VGS = 10V, ID = 52A VGS = VDS, ID = 6mA VGS = 20 V, VDS = 0V Dynamic Characteristics Symbol Characteristic Ciss Input Capacitance Coss Output Capacitance Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff Total gate Charge Gate - Source Charge Gate - Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGS = 0V ; VDS = 100V f = 1MHz VGS = 10V VBus = 400V ID = 52A Inductive Switching (125C) VGS = 10V VBus = 600V ID = 52A RG = 3.8 Inductive switching @ 25C VGS = 10V ; VBus = 600V ID = 52A ; RG = 3.8 Inductive switching @ 125C VGS = 10V ; VBus = 600V ID = 52A ; RG = 3.8 Min Typ 13.6 0.66 540 64 230 70 20 400 25 3 1.5 4.2 1.7 mJ ns nC Max Unit nF mJ Chopper diode ratings and characteristics Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge IF = 60A IF = 120A IF = 60A IF = 60A VR = 667V Test Conditions VR=1000V Tj = 25C Tj = 125C Tc = 80C Min 1000 Typ Max 100 500 60 2.2 2.8 1.8 235 305 460 2600 2.8 V ns nC August, 2009 2-5 APTC90DAM60T1G - Rev 0 Unit V A A Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C di/dt =200A/s www.microsemi.com APTC90DAM60T1G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight CoolMOS diode 4000 -40 -40 -40 2.5 Min Typ Max 0.27 0.9 150 125 100 4.7 80 Unit C/W V C N.m g RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz To heatsink M4 Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol R25 R25/R25 B25/85 B/B Characteristic Resistance @ 25C T25 = 298.15 K TC=100C RT = R25 T: Thermistor temperature 1 1 RT: Thermistor value at T exp B25 / 85 T - T 25 Min Typ 50 5 3952 4 Max Unit k % K % SP1 Package outline (dimensions in mm) See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com www.microsemi.com 3-5 APTC90DAM60T1G - Rev 0 August, 2009 APTC90DAM60T1G Typical CoolMOS Performance Curve 0.3 Thermal Impedance (C/W) 0.25 0.2 0.15 0.1 0.05 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.9 0.7 0.5 0.3 0.1 0.05 Single Pulse 0 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) Low Voltage Output Characteristics VGS=20, 8V 160 6V BVDSS, Drain to Source Breakdown Voltage 240 ID, Drain Current (A) Breakdown Voltage vs Temperature 1000 975 950 925 900 25 50 75 100 125 TJ, Junction Temperature (C) DC Drain Current vs Case Temperature 60 ID, DC Drain Current (A) 50 40 30 20 10 0 5V 80 0 0 5 10 15 VDS, Drain to Source Voltage (V) Maximum Safe Operating Area 1000 ID, Drain Current (A) 20 100 limited by RDSon 100 s 10 Single pulse TJ=150C TC=25C 1 10 100 10 ms 1 1000 VDS, Drain to Source Voltage (V) Capacitance vs Drain to Source Voltage Ciss C, Capacitance (pF) 10000 1000 100 10 1 0 25 50 75 100 125 150 175 200 VDS, Drain to Source Voltage (V) Crss Coss VGS, Gate to Source Voltage (V) 100000 10 25 50 75 100 125 TC, Case Temperature (C) 150 Gate Charge vs Gate to Source Voltage VDS=400V ID=52A TJ=25C 6 4 2 0 0 100 200 300 400 Gate Charge (nC) 500 600 www.microsemi.com 4-5 APTC90DAM60T1G - Rev 0 August, 2009 8 APTC90DAM60T1G 400 ZVS RDS(on), Drain to Source ON resistance (Normalized) Operating Frequency vs Drain Current VDS=600V D=50% RG=3.8 TJ=125C TC=75C ON resistance vs Temperature 3.0 2.5 2.0 1.5 1.0 0.5 25 50 75 100 125 150 TJ, Junction Temperature (C) Switching Energy vs Gate Resistance Frequency (kHz) 300 200 Hard switching 100 0 20 25 ZCS 30 35 40 45 50 ID, Drain Current (A) Switching Energy vs Current 8 Eon and Eoff (mJ) 6 4 Eoff VDS=600V RG=3.8 TJ=125C L=100H 7 Switching Energy (mJ) 6 5 4 3 2 1 0 0 5 10 VDS=600V ID=52A TJ=125C L=100H Eon Eoff Eon 2 0 10 20 30 40 50 60 ID, Drain Current (A) 70 80 15 20 Gate Resistance (Ohms) "COOLMOSTM comprise a new family of transistors developed by Infineon Technologies AG. "COOLMOS" is a trademark of Infineon Technologies AG". Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5-5 APTC90DAM60T1G - Rev 0 August, 2009 |
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